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NXP Semiconductors
IP4358CX6
Quad channel low capacitance ESD protection
8. Design and assembly recommendations
8.1 PCB design guidelines
It is recommended, for optimum performance, to use a Non-Solder Mask Defined
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
Refer to Table 6 for the recommended PCB design parameters.
Table 6.
Parameter
Recommended PCB design parameters
Value or specification
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
250 μ m
100 μ m (0.004 inch)
325 μ m
20 μ m to 40 μ m
AuNi or OSP
FR4
8.2 PCB assembly guidelines for Pb-free soldering
Table 7.
Parameter
Assembly recommendations
Value or specification
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
Solder reflow profile
T
( ° C)
T reflow(peak)
250
230
217
preheat
290 μ m
100 μ m (0.004 inch)
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
50 : 50
see Figure 6
cooling rate
t 1
t 2
t (s)
t 3
t 4
t 5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 6.
Pb-free solder reflow profile
IP4358CX6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 October 2010
? NXP B.V. 2010. All rights reserved.
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